Markem-Imaje, the global provider of end-to-end supply chain solutions and industrial marking and coding systems for multiple major brands, will invite attendees to experience its exciting cross-sector print and packaging innovations at PACK EXPO in Las Vegas from 11 to 13 September.
Brands across multiple market segments face a challenging environment of unpredictable production prices and increased demands for traceability, regulatory and consumer compliance, and pressure to fulfill both ESG KPIs and cater to new recyclable substrates.
“Manufacturers and retailers need to increasingly embrace the cost-saving, production-boosting benefits of ever-evolving packaging hardware plus software that also helps to protect brand reputation, margins, and consumer demands,” says Dale Voney, vice president for the Americas at Markem-Imaje. “This is why we have been innovating solutions that save on costs and contamination and ensure compliance with the newest industry regulatory requirements and standards like the US FDA’s upcoming Food Safety Modernization Act’s (FSMA) Final Rule and GS1 Digital Link.”
The newest Markem-Imaje innovation to be showcased at PACK EXPO Las Vegas 2023 will be the revolutionary Super Piezo Inkjet (SPI) marking technology, which has been designed to answer the demand of brands to have high-quality print, including serialized 2D codes, essential to the FSMA and the revolution coming to the market in dynamic barcodes from GS1. The technology will allow brands to mark their products with unique codes on 3D complex surfaces at very high speeds.
Markem-Imaje will also demonstrate its latest state-of-the-art laser models, each responding to industry demands in the segment’s three technologies and helping improve ESG goals while boosting productivity. The company’s new ultraviolet technology, the UV500, excels on complex materials where other laser technologies cannot perform so well, including on the finest, easily damaged substrates like new, more environmentally friendly thinner mono films, as well as polymer labels and thermoplastics like High-density polyethylene (HDP).
Another main attraction at the Markem-Imaje stand will be its SmartLase CO2 lasers, producing superb 2D code-compliant quality and efficiency on all substrates, including mono-materials and foils with high recycled content. New applications for the successful C600 include an extra wide printhead, the X-WIDE, offering five times more printing area, and the BOU, designed to fit into the most challenging spaces, an adaptation beneficial to the beverage industry.
Markem-Imaje will also demonstrate its software, including Packaging Intelligence, CoLOS, which integrates with almost all ERP and MES systems, including SAP, to record and encode the detailed traceability data required for the FSMA and other regulations. We will also display the BlueBite consumer engagement software that provides end-to-end supply chain transparency, traceability, and consumer interaction.
Additionally, the latest in Thermal Transfer Overprinting (TTO), Print and apply (P&A), and Continuous Inkjet (CIJ) innovations will be on display. Within CIJ, Markem-Imaje will showcase its 9750 range of printers capable of robust traceability coding, including text messages up to five lines, logos, and high-resolution 1D and 2D codes, on a vast array of packaging. Within the range are models specifically developed for the FMCG sector peak results, even in high humidity, dusty conditions, and on ultra-fast lines; the first hybrid CIJ coder with the flexibility to mark with both dyes and pigmented inks; and a model primed for producing camera-readable GS1-compliant dynamic codes as small as 5mm, or 0.2 inches high.
PACK EXPO 2023, held in the Las Vegas Convention Center between 11 to 13 September, is one of the US’ most significant general packaging and processing events, attracting 30,000 visitors and exhibitors every two years. Visit the Markem-Imaje stand at PACK EXPO 2023, Central Hall, Stall 1528, and experience the latest innovations in print and packaging for sectors from FCMG to pharma.